Industrial
High-Speed Memory IC Burn-In Series Products
Product Introduction:
This product is a highly reliable, mass-production burn-in test solution specifically designed for high-speed memory chips.
By simulating extreme operating environments such as high temperature and high voltage inside the chamber, it accelerates the chip aging process, exposes potential latent defects early, and effectively screens out infant mortality failures, thereby ensuring long-term stability and durability of the chips.
As the first domestic mass-production model capable of meeting the burn-in testing requirements for high-speed memory chips, this series offers an efficient and reliable localized solution for chip reliability verification.
Technical Specs & Core Performance:
|
Technical Specifications |
Configuration |
Single chamber: 24 slots; Dual chamber: 48 slots |
|
Tray Spacing |
45mm |
|
|
Automation Options |
Automatic test board insertion / extraction mechanism; Automatic door opener (optional) |
|
|
Performance Parameters |
Temperature Range (°C) |
-10℃~150℃；-40℃~150℃；-70℃~150℃（Optional） |
|
Temperature Uniformity (°C) |
±1°C (Empty); ±3°C (Loaded) |
|
|
Power Capacity (kW) |
6.5kw |
Core Advantages & Quality Commitment
1. Mass Production Design: Optimized for high-volume manufacturing environments to meet high-throughput testing demands.
2. High Compatibility: Compatible with mainstream domestic and international BIB boards and system boards, enabling easy integration.
3. Intelligent Control: Equipped with proprietary DHT component-based intelligent control algorithm for precise and stable test process control.
4. Flexible Configuration: Available in memory chip burn-in models with two capacity options and two temperature range options.
5. Superior Quality: Industrial-grade durability featuring low power consumption, stable operation and long service lifespan.
6. Service Guarantee: Five-year warranty and professional technical support services.
Typical Applications:
1. Supported ICs: DDR3/DDR4/DDR5, LPDDR4/LPDDR5, eMMC, UFS, NAND Flash, and other memory chips.
2. Application Fields: GPU manufacturers, memory chip manufacturers, OSATs, high-end electronic equipment suppliers; key industries such as automotive electronics, AI, cloud computing, and IoT.